Munich, Germany

Siegfried Bock


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 1980

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1 patent (USPTO):Explore Patents

Title: Siegfried Bock: Innovator in Electrical Thin Layer Circuits

Introduction

Siegfried Bock is a notable inventor based in Munich, Germany. He has made significant contributions to the field of electrical engineering, particularly in the production of thin layer circuits. His innovative methods have streamlined the manufacturing process, making it more efficient and effective.

Latest Patents

Siegfried Bock holds a patent for a "Method for producing an electrical thin layer circuit." This method involves creating an electric thin layer circuit that includes at least one capacitor and a conductor path and/or a resistor. The process reduces the number of masks required for production, enhancing efficiency. The method utilizes layers of tantalum-aluminum alloy and involves several masking and etching techniques to achieve the desired circuit elements.

Career Highlights

Siegfried Bock is associated with Siemens Aktiengesellschaft, a leading global technology company. His work at Siemens has allowed him to develop and refine his innovative methods in electrical engineering. His patent reflects his expertise and commitment to advancing technology in this field.

Collaborations

Siegfried has collaborated with notable colleagues such as Wolf-Dieter Munz and Hans W Potzlberger. These collaborations have contributed to the development of his patented methods and have fostered innovation within the company.

Conclusion

Siegfried Bock's contributions to the field of electrical engineering, particularly through his patented method for producing thin layer circuits, highlight his role as an innovator. His work continues to influence the industry and pave the way for future advancements.

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