Atherton, CA, United States of America

Sidney Liebes, Jr

This inventor holds 4 USPTO granted patents. Top assignee: Hewlett-Packard Company. Active years: 1987-1991.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sidney Liebes, Jr. Retrieved from https://idiyas.com/inventor/sidney-liebes-jr

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.6

ph-index = 3

Forward Citations = 81(Granted Patents)


Company Filing History:


Years Active: 1987-1991

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4 patents (USPTO):Explore Patents

Title: Sidney Liebes, Jr.: Innovator in Electronic Component Alignment

Introduction

Sidney Liebes, Jr. is a distinguished inventor based in Atherton, California, recognized for her contributions to the field of electronic component alignment. With a portfolio of four patents, Liebes has made significant advancements that enhance the efficiency and accuracy of electronic component manufacturing processes.

Latest Patents

Among her latest innovations, Liebes developed a patented method for the mechanical simultaneous registration of multi-pin surface-mount devices (SMDs). This invention presents a structure that aligns SMDs to a substrate by incorporating a mating physical structure in both the SMD and substrate. This design allows for rapid placement and precise alignment, mitigating the risk of improper rotation and placement of components. Additionally, she introduced a system for sensing and forming objects, specifically the leads of electronic components. This automatic lead sensing and fine-forming system prepares electronic leads for seamless insertion into printed circuit boards by intelligently sensing and adjusting their positions as necessary.

Career Highlights

Liebes has spent a significant portion of her career at Hewlett-Packard Company, where her innovations have contributed to the efficiency of electronic manufacturing. Her work in enhancing the alignment of SMDs and the processing of electronic leads has been instrumental in the development of more effective assembly methods in the electronics industry.

Collaborations

Throughout her career, Sidney has collaborated with notable colleagues including John R. Birk and Heinz Breu. Together, they have worked on advancing technologies that facilitate improved manufacturing processes within electronic component production.

Conclusion

Sidney Liebes, Jr. has established herself as a key player in the innovation of electronic manufacturing through her patented inventions. Her efforts, particularly in the alignment of SMDs and lead formation systems, highlight her commitment to enhancing the efficiency and reliability of electronic devices, marking a significant impact on the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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