Shung-Bo Lin

Title: The Innovative Contributions of Shung-Bo Lin

Introduction

Shung-Bo Lin is a notable inventor based in Chu-pei, Taiwan. He has made significant contributions to the field of semiconductor testing through his innovative designs. His work has been recognized for its technical excellence and practical applications in the industry.

Latest Patents

Shung-Bo Lin holds a patent for a "Circuit board for semiconductor test." This invention includes first and second sub-circuit boards, along with an insulating dielectric layer positioned between them. Each sub-circuit board is equipped with a substrate and circuits that feature upper and lower contacts. The insulating dielectric layer contains through holes and connecting conductors that are electrically linked to the upper and lower contacts of the two sub-circuit boards. The design of the circuit board is defined by central and peripheral regions, enhancing its functionality. The lower contacts of the first sub-circuit board in the central region connect to a probe head, while the upper contacts of the second sub-circuit board in the peripheral region connect to a tester. This configuration allows for greater power test uniformity, making it a valuable asset in semiconductor testing.

Career Highlights

Shung-Bo Lin is currently associated with Mpi Corporation, where he continues to innovate and contribute to advancements in semiconductor technology. His work has not only improved testing methods but has also set new standards in the industry.

Collaborations

Shung-Bo Lin collaborates with talented individuals such as Shih-Ching Chen and Jun-Liang Lai. Their combined expertise fosters a creative environment that drives innovation and enhances the quality of their projects.

Conclusion

Shung-Bo Lin's contributions to semiconductor testing through his patented circuit board design exemplify his commitment to innovation. His work at Mpi Corporation and collaborations with skilled colleagues further highlight his impact on the industry.