Shun Ming Fung

Title: Shun Ming Fung: Innovator in Bonding and Placement Technologies

Introduction

Shun Ming Fung is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of bonding and placement technologies, holding a total of 2 patents. His innovative work focuses on improving the efficiency and accuracy of die bonding processes.

Latest Patents

Fung's latest patents include an "Apparatus and method of determining a bonding position of a die." This invention provides an apparatus that includes a bond head for picking up and bonding the die, along with a plurality of cameras designed to capture images of the die's surfaces. The method determines the bonding position based on these captured images, enhancing the precision of the bonding process.

Another significant patent is the "Apparatus and method for locating a plurality of placement positions on a carrier object." This optical apparatus features an imaging device with multiple sensors that capture images of selected rows of placement positions. A positioning device allows the imaging device to be adjusted relative to successive rows, while a processor processes the images to identify the exact locations of the placement positions.

Career Highlights

Shun Ming Fung is currently employed at Asm Technology Singapore Pte Ltd, where he continues to develop innovative solutions in his field. His work has been instrumental in advancing technologies that streamline manufacturing processes.

Collaborations

Fung collaborates with talented individuals such as Kui Kam Lam and Chi Keung Leung, contributing to a dynamic work environment that fosters innovation and creativity.

Conclusion

Shun Ming Fung's contributions to bonding and placement technologies exemplify his commitment to innovation. His patents reflect a deep understanding of the challenges in the industry and a dedication to finding effective solutions.