Shun-Kuan Lin

Title: Shun-Kuan Lin: Innovator in 3D Integrated Circuit Technology

Introduction

Shun-Kuan Lin is a notable inventor based in Tainan, Taiwan. He has made significant contributions to the field of integrated circuit technology, particularly in the development of three-dimensional (3D) integrated circuits.

Latest Patents

Shun-Kuan Lin holds a patent for a "Shared pad/bridge layout for a 3D IC." This patent describes various embodiments directed towards a shared frontside pad/bridge layout for a 3D integrated circuit. The invention involves a second IC die that underlies the first IC die, and a third IC die that underlies the second IC die. The layout includes a first-die backside pad, a second-die backside pad, and a third-die backside pad arranged in a row, which overlie the respective IC dies. These pads are electrically coupled to individual semiconductor devices of the IC dies, facilitating efficient electrical connections.

Career Highlights

Shun-Kuan Lin is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work focuses on advancing technologies that enhance the performance and efficiency of integrated circuits.

Collaborations

Shun-Kuan Lin has collaborated with notable colleagues such as Harry-Hak-Lay Chuang and Wei-Cheng Wu. Their combined expertise contributes to the innovative projects at their company.

Conclusion

Shun-Kuan Lin's contributions to 3D integrated circuit technology exemplify the importance of innovation in the semiconductor industry. His patent and collaborative efforts highlight the ongoing advancements in this critical field.