Apple Valley, MN, United States of America

Shuiyan Huang

This inventor holds 1 USPTO granted patent. Top assignee: Seagate Technology Incorporated. Active years: 2012.


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 14(Granted Patents)


Company Filing History:


Years Active: 2012

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Innovations of Shuiyan Huang in Semiconductor Technology

Introduction

Shuiyan Huang is a notable inventor based in Apple Valley, MN (US). He has made significant contributions to the field of semiconductor technology, particularly in the formation of conductive via plugs. His innovative approach has led to advancements that enhance the performance and reliability of semiconductor devices.

Latest Patents

Shuiyan Huang holds 1 patent for his invention titled "Conductive via plug formation." This patent describes a method of forming a conductive via plug in a semiconductor device. The process involves depositing a tungsten seed layer on a plurality of metal barrier layers within a recess using atomic layer deposition. Subsequently, the recess is filled with tungsten using chemical vapor deposition, establishing an electrical connection between the first and second metal layers.

Career Highlights

Huang is currently employed at Seagate Technology Incorporated, a leading company in data storage solutions. His work at Seagate has allowed him to apply his expertise in semiconductor technology to develop innovative products that meet the demands of modern data storage.

Collaborations

Shuiyan Huang has collaborated with several talented individuals in his field, including Antoine Khoueir and Yongchul Ahn. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Shuiyan Huang's contributions to semiconductor technology through his innovative patent and work at Seagate Technology Incorporated highlight his role as a key inventor in the industry. His advancements in conductive via plug formation are paving the way for future developments in semiconductor devices.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to [email protected]
Loading…