Shimodate, Japan

Shuichi Hatakeyama


Average Co-Inventor Count = 5.3

ph-index = 4

Forward Citations = 57(Granted Patents)


Location History:

  • Shimodate, JP (1995 - 1997)
  • Tochigi, JP (2013)

Company Filing History:


Years Active: 1995-2013

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5 patents (USPTO):Explore Patents

Title: Innovations of Shuichi Hatakeyama

Introduction

Shuichi Hatakeyama is a notable inventor based in Shimodate, Japan. He has made significant contributions to the field of semiconductor technology and printed wiring boards. With a total of five patents to his name, Hatakeyama's work focuses on improving connection reliability and heat resistance in electronic components.

Latest Patents

His latest patents include a connecting terminal and a semiconductor package that utilizes this terminal. The innovation enhances connection reliability through a unique layering of materials, including a conductive layer, electroless nickel plating, and multiple palladium plating films. Additionally, he has developed a metal foil for printed wiring boards that features a copper layer and a nickel-phosphorus alloy layer, which is designed to withstand high temperatures during production.

Career Highlights

Shuichi Hatakeyama is currently employed at Hitachi Chemical Company, Ltd., where he continues to advance his research and development efforts. His work has been instrumental in enhancing the performance and reliability of electronic components.

Collaborations

He has collaborated with notable coworkers such as Naoyuki Urasaki and Kouichi Tsuyama, contributing to various projects that push the boundaries of technology in their field.

Conclusion

Shuichi Hatakeyama's innovative patents and contributions to semiconductor technology and printed wiring boards highlight his importance as an inventor. His work continues to influence the industry and improve electronic component reliability.

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