The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2013
Filed:
Apr. 23, 2008
Yoshinori Ejiri, Ibaraki, JP;
Shuichi Hatakeyama, Tochigi, JP;
Shigeharu Arike, Tochigi, JP;
Kiyoshi Hasegawa, Ibaraki, JP;
Yoshinori Ejiri, Ibaraki, JP;
Shuichi Hatakeyama, Tochigi, JP;
Shigeharu Arike, Tochigi, JP;
Kiyoshi Hasegawa, Ibaraki, JP;
Hitachi Chemical Company, Ltd., Tokyo, JP;
Abstract
The connection reliability of connecting terminals with displacement gold plating films is improved by connecting terminals comprising a conductive layer, an electroless nickel plating film, a first palladium plating film which is a displacement or electroless palladium plating film with a purity of 99% by mass or greater, a second palladium plating film which is an electroless palladium plating film with a purity of at least 90% by mass and less than 99% by mass, and a displacement gold plating film, wherein the electroless nickel plating film, the first palladium plating film, the second palladium plating film and the displacement gold plating film are laminated in that order on one side of the conductive layer, and the displacement gold plating film is situated on the uppermost surface layer on the opposite side from the conductive layer.