The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 1995
Filed:
May. 12, 1993
Applicant:
Inventors:
Naoyuki Urasaki, Shimodate, JP;
Kouichi Tsuyama, Shimodate, JP;
Kiyoshi Hasegawa, Yuki, JP;
Shuichi Hatakeyama, Shimodate, JP;
Akinari Kida, Tochigi, JP;
Akishi Nakaso, Oyama, JP;
Hiroshi Nomura, Oyama, JP;
Assignee:
Hitachi Chemical Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ; B32B / ;
U.S. Cl.
CPC ...
428607 ; 428612 ; 428675 ; 428687 ; 428935 ;
Abstract
A metal foil for printed wiring boards comprising a first copper layer to be adhered to a resin, a second copper layer having a sufficient strength as a metal layer and a nickel-phosphorus alloy layer containing 1.1% by weight or more of phosphorus formed between the first and second copper layers is suitable for producing printed wiring boards having excellent heat resistance, particularly during production procedures.