Tokyo, Japan

Shuhei Oshida

This inventor holds 1 USPTO granted patent. Top assignee: Tokyo Seimitsu Co., Ltd.. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shuhei Oshida. Retrieved from https://idiyas.com/inventor/shuhei-oshida

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Shuhei Oshida: Innovator in Laser Machining Technology

Introduction

Shuhei Oshida is a prominent inventor based in Tokyo, Japan. He is known for his innovative contributions to laser machining technology. With a focus on precision and efficiency, his work has significantly impacted the field of manufacturing.

Latest Patents

Oshida holds a patent for a "Laser machining device and control method therefor." This device condenses laser light inside a wafer, forming modified regions across multiple layers. It features an infrared imaging optical system that faces one surface of the wafer. The system is designed to simultaneously image modified regions on both the wafer's surface and the opposite side, enhancing the accuracy of the machining process. He has 1 patent to his name.

Career Highlights

Oshida is associated with Tokyo Seimitsu Co., Ltd., a company renowned for its advanced manufacturing technologies. His work at the company has allowed him to develop cutting-edge solutions that improve production capabilities.

Collaborations

Throughout his career, Oshida has collaborated with notable colleagues, including Masanobu Koyata and Takashi Shimanuki. These partnerships have fostered innovation and contributed to the advancement of laser machining techniques.

Conclusion

Shuhei Oshida's contributions to laser machining technology exemplify the spirit of innovation in the manufacturing industry. His patented device showcases the potential of laser technology in enhancing precision and efficiency.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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