Company Filing History:
Years Active: 2017-2019
Title: The Innovations of Shuhei Fukaya
Introduction
Shuhei Fukaya is a notable inventor based in Obu, Japan. He has made significant contributions to the field of flexible wiring technology, holding a total of 2 patents. His work focuses on enhancing the durability and functionality of flexible wiring boards and conductive pastes.
Latest Patents
Fukaya's latest patents include a flexible wiring board and a thermosetting conductive paste. The flexible wiring board features a flexible substrate and a conductive film that contains a conductive powder and a heat curable resin. This innovative design ensures high durability, achieving a pencil hardness of at least 2H and an adhesiveness rating of at least 95/100. The thermosetting conductive paste is designed for forming conductive coatings and comprises a conductive powder, a heat curable epoxy resin, and a curing agent. The unique composition of the conductive powder includes an aliphatic polyvalent carboxylic acid adhered to a powdered metal core, enhancing its performance.
Career Highlights
Fukaya is currently employed at Noritake Co., Ltd., where he continues to develop innovative solutions in the field of electronics. His expertise in flexible wiring technology has positioned him as a key player in the industry.
Collaborations
He has collaborated with talented coworkers such as Tatsuya Baba and Hirohito Kakizoe, contributing to the advancement of their projects and innovations.
Conclusion
Shuhei Fukaya's contributions to flexible wiring technology and conductive materials demonstrate his commitment to innovation and excellence in his field. His patents reflect a deep understanding of material science and engineering, paving the way for future advancements.