The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 2019

Filed:

Mar. 22, 2016
Applicant:

Noritake Co., Limited, Nagoya-shi, Aichi, JP;

Inventors:

Shuhei Fukaya, Obu, JP;

Hirohito Kakizoe, Ichinomiya, JP;

Tatsuya Baba, Nagoya, JP;

Terusada Sugiura, Toyota, JP;

Yasushi Yoshino, Nagoya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/24 (2006.01); C08G 59/36 (2006.01); C08G 59/38 (2006.01); C08L 63/00 (2006.01); C08K 3/08 (2006.01);
U.S. Cl.
CPC ...
C08G 59/24 (2013.01); C08G 59/36 (2013.01); C08G 59/38 (2013.01); C08L 63/00 (2013.01); C08K 2003/0806 (2013.01);
Abstract

Provided is a flexible wiring board having high durability. The present invention provides a flexible wiring board including a flexible substrate and a conductive film formed on the flexible substrate. The conductive film contains a conductive powder and a curd product of a heat curable resin. The conductive film has pencil hardness of at least 2H, based on a pencil scratch hardness test in accordance with JIS K5600 5-4 (1999). The conductive film has adhesiveness of at least 95/100 by a 100 squares cross-cut test in accordance with JIS K5400 (1990).


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