Noritake Co., Ltd.

Shuhei Fukaya

Tatsuya Baba

Shigeru Sakamoto

Yasushi Yoshino

Hirohito Kakizoe

Terusada Sugiura

Provided is a flexible wiring board having high durability. The present invention provides a flexible wiring board including a flexible substrate and a conductive film formed on the flexible substrate. The conductive film contains a conductive powder and a curd product of a heat curable resin. The conductive film has pencil hardness of at least 2H, based on a pencil scratch hardness test in accordance with JIS K5600 5-4 (1999). The conductive film has adhesiveness of at least 95/100 by a 100 squares cross-cut test in accordance with JIS K5400 (1990).

Flexible wiring board and use thereof

Provided is a heat curable conductive paste used to form a conductive coating. The heat curable conductive paste comprises a conductive powder, a heat curable epoxy resin and a curing agent. In the conductive powder, an aliphatic polyvalent carboxylic acid is adhered on a surface of a powdered metal core. The epoxy resin comprises a bifunctional or higher polyfunctional epoxy resin and a monofunctional epoxy resin, and the polyfunctional epoxy resin and the monofunctional epoxy resin have a mass ratio of 90:10 to 20:80.

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Obu, Japan

Shuhei Fukaya