Fremont, CA, United States of America

Shufun Ho


Average Co-Inventor Count = 2.4

ph-index = 5

Forward Citations = 269(Granted Patents)


Company Filing History:


Years Active: 2005-2016

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7 patents (USPTO):Explore Patents

Title: Shufun Ho: Innovator in Head Stack Assembly Technology

Introduction

Shufun Ho is a prominent inventor based in Fremont, CA, known for his contributions to the field of head stack assembly technology. With a total of 7 patents to his name, he has made significant advancements that enhance the functionality and efficiency of data storage devices.

Latest Patents

One of his latest patents is titled "Head stack assembly with a flexible printed circuit having a mouth centered between arms." This innovative head stack assembly (HSA) features a flexible printed circuit (FPC) that includes a mouth with an upper and lower mouth edge. The FPC is designed with a first plurality of conductive terminals adjacent to the upper mouth edge and a second plurality adjacent to the lower mouth edge. The mouth is bisected by a centerline that is parallel and equidistant from the actuator arms of the HSA. Each head gimbal assembly (HGA) attached to the actuator arms includes a flexure tail laminate with a dielectric layer between conductive traces and a structural layer, ensuring efficient electrical connectivity.

Career Highlights

Shufun Ho has built a successful career at Western Digital Technologies, Inc., where he has been instrumental in developing cutting-edge technologies for data storage solutions. His work has not only contributed to the company's success but has also advanced the industry as a whole.

Collaborations

Throughout his career, Shufun has collaborated with notable colleagues, including Tzong-Shii Pan and Kamran Oveyssi. These partnerships have fostered innovation and have led to the successful development of various technologies in the field.

Conclusion

Shufun Ho's contributions to head stack assembly technology exemplify his dedication to innovation and excellence. His patents and collaborative efforts continue to shape the future of data storage solutions.

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