The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 04, 2008

Filed:

Aug. 08, 2006
Applicants:

Shufun Ho, Fremont, CA (US);

Alex Y. Tsay, Fremont, CA (US);

Ali Hosseinzadeh, Fremont, CA (US);

Dennis W. Hogg, Laguna Hills, CA (US);

Chee Shu Tay, Petaling Jaya, MY;

Inventors:

Shufun Ho, Fremont, CA (US);

Alex Y. Tsay, Fremont, CA (US);

Ali Hosseinzadeh, Fremont, CA (US);

Dennis W. Hogg, Laguna Hills, CA (US);

Chee Shu Tay, Petaling Jaya, MY;

Assignee:

Western Digital Technologies, Inc., Lake Forest, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor die mounted to a flex cable is provided. The flex cable comprises a heat sink layer and a flex cable substrate having conductive traces disposed thereon. The flex cable substrate includes an aperture aligned with the semiconductor die. A thermal conductor disposed within the aperture contacts both the semiconductor die and the heat sink layer. The thermal conductor can comprise, for example, a set of solder balls.


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