Chongqing, China

Shuai Li

This inventor holds 3 USPTO granted patents and 1 published patent application. Top assignee: Ccteg Chongqing Research Institute. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shuai Li. Retrieved from https://idiyas.com/inventor/shuai-li-79ibzntc

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 3 

Average Co-Inventor Count = 15.4

ph-index = 1


Company Filing History:


Years Active: 2026

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3 patents (USPTO):Explore Patents

Title: Shuai Li and Innovations in Abrasive Jet Cutting

Introduction

Shuai Li is an inventor based in Chongqing, China, whose patent work focuses on mining equipment and technologies for coal seam pressure relief and permeability improvement. He is associated with CCTEG Chongqing Research Institute and has 3 patents.

Latest Patents

One of Li’s latest inventions is the “Rear-Mounted Double-Channel Abrasive Jet Cutting Device.” The device conveys high-pressure water and abrasive through separate channels, reducing wear on hoses and drilling tools and avoiding pressure loss associated with mixed conveyance. Its design aims to improve coal-breaking performance and extend the service life of the cutting apparatus.

Another listed patent is “Mining Hose Connecting Device and Method,” which concerns equipment and methods for connecting mining hoses.

Career Highlights

Li’s patent portfolio reflects work on practical engineering solutions for mining operations. His inventions address equipment durability and the performance of high-pressure water jet cutting.

Collaborations

Li’s listed coworkers include Yongjiang Zhang and Lindong Guo. His work is associated with CCTEG Chongqing Research Institute.

Conclusion

Shuai Li’s inventions focus on improving mining equipment, with particular attention to abrasive jet cutting performance, pressure delivery, and component service life.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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