Shu Jung Ma

Title: Innovator Shu Jung Ma: Pioneering Advances in Semiconductor Packaging

Introduction

Shu Jung Ma, an accomplished inventor based in Kaohsiung, Taiwan, has made significant strides in the realm of semiconductor packaging technology. With a portfolio of three patents, he has demonstrated exceptional innovation in the field, particularly through his contributions to ball grid array (BGA) semiconductor packages.

Latest Patents

Ma's latest inventions focus on enhancing the performance and efficiency of semiconductor packages. One of his notable patents is a comprehensive BGA semiconductor package that features a chip mounted centrally on the upper surface of a substrate. This innovative design includes a ground plate positioned under the upper surface and a power plate situated between the ground plate and lower surface. The invention also details a ground ring that encircles the chip, equipped with serrated portions that interlace with a first power ring. This intricate setup minimizes wire bonding distances, ensuring superior electrical performance. Furthermore, his substrate design innovatively includes a defined pad distribution that optimizes connectivity and functionality for semiconductor chip packaging.

Career Highlights

Shu Jung Ma is affiliated with Advanced Semiconductor Engineering, Inc., a leading company in the semiconductor industry. Throughout his career, he has consistently focused on developing cutting-edge technologies that enhance the performance and reliability of semiconductor elements. His innovative mindset and technical expertise have significantly contributed to the evolution of semiconductor packaging.

Collaborations

In his professional journey, Shu Jung Ma has collaborated with notable colleagues, including Yung I Yeh and Shiun Jaw Hsien. Together, they have engaged in pioneering projects that push the boundaries of semiconductor technology, emphasizing teamwork and synergy in the innovation process.

Conclusion

Shu Jung Ma continues to be a pivotal figure in semiconductor packaging, with his patents reflecting his commitment to innovation and excellence. As he furthers his work at Advanced Semiconductor Engineering, Inc., the impact of his contributions is expected to be felt across the semiconductor industry, shaping the future of technology. His journey underscores the importance of creativity and collaboration in driving advancements in the field.