The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2002
Filed:
Sep. 18, 2000
Shu Jung Ma, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaoshiung, TW;
Abstract
A substrate for use in packaging of a semiconductor chip is disclosed. The upper surface of the substrate comprises a die covering area adapted for receiving the chip, a ground ring and a power ring. The lower surface of the substrate comprises a plurality of first contact pads right under the vicinity of the ground ring and the power ring, and a plurality of second contact pads surrounding the first contact pads. It is noted that the first contact pads are divided into a two groups electrically connected to the ground ring and the power ring, respectively. Preferably, the lower surface of the substrate is further provided with a plurality of dummy pads at a position right under the periphery of the die covering area and a plurality of third contact pads located right under the die covering area.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile