Taipei, Taiwan

Shu-Hung Lin

USPTO Granted Patents = 11 

Average Co-Inventor Count = 3.7

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2021-2025

Loading Chart...
11 patents (USPTO):Explore Patents

Title: Innovations of Shu-Hung Lin in Wafer Technology

Introduction

Shu-Hung Lin is a prominent inventor based in New Taipei, Taiwan. He has made significant contributions to the field of wafer technology, holding a total of 11 patents. His innovative designs focus on enhancing the functionality and efficiency of wafer containers and gas diffusion devices.

Latest Patents

Among his latest patents are the "Gas diffusion device" and "wafer container including the same." This invention provides a wafer container that includes a shell made of thermal resistance materials. The gas diffusion device, when assembled with the wafer container, utilizes a coupling structure and a collar as a protection mechanism. It features a buffering chamber that allows for gas tolerance and communication before entering the interior space of the wafer container. Another notable patent is the "Reticle pod with quick-release support mechanism." This invention comprises a lower cover with a carrying surface and securing seats, along with a support mechanism that can be selectively installed on the lower cover.

Career Highlights

Shu-Hung Lin works at Gudeng Precision Industrial Co., Ltd., where he continues to develop innovative solutions in the semiconductor industry. His work has significantly impacted the efficiency and reliability of wafer handling and processing.

Collaborations

He collaborates with talented coworkers such as Chia-Ho Chuang and Ming-Chien Chiu, contributing to a dynamic and innovative work environment.

Conclusion

Shu-Hung Lin's contributions to wafer technology through his patents demonstrate his commitment to innovation and excellence in the field. His work continues to influence the industry and pave the way for future advancements.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…