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For the Inventor, By the Inventor

Taipei Hsien, Taiwan

Shu-Hui Chen

USPTO Granted Patents = 11

Average Co-Inventor Count = 2.7

ph-index = 2

Forward Citations = 19(Granted Patents)


Location History:

  • Ban-Chiao, TW (2000)
  • Taipei, TW (2002)
  • Taipei Hsien, TW (2001 - 2005)

Company Filing History:

goldMedal10 out of 1,963 
 
Via Technologies, Inc.
 patents
silverMedal1 out of 1 
 
Via Technologyies, Inc.
 patent

Years Active: 2000-2005

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11 patents (USPTO):Explore Patents
1. 6946731 - Layout structure for providing stable power source to a main bridge chip substrate and a motherboard (2005-09-20),
2. 6888071 - Layout structure and method for supporting two different package techniques of CPU (2005-05-03),
3. 6877102 - Chipset supporting multiple CPU's and layout method thereof (2005-04-05),
4. 6844620 - Power layout structure of main bridge chip substrate and motherboard (2005-01-18),
5. 6794744 - Layout structure and method for supporting two different package techniques of CPU (2004-09-21),
6. 6696763 - Solder ball allocation on a chip and method of the same (2004-02-24),
7. 6459045 - PCB structure for regulating constant power source and strengthening ground connections (2002-10-01),
8. 6384346 - Trace layout of a printed circuit board with AGP and PCI slots (2002-05-07),
9. 6377510 - Memory control system for controlling write-enable signals (2002-04-23),
10. 6320758 - Integrated circuit mounting board with bypass capacitors (2001-11-20),
11. 6134701 - Computer motherboard with a control chip having specific pin arrangement (2000-10-17),

Title: Innovations of Shu-Hui Chen

Introduction

Shu-Hui Chen is a prominent inventor based in Taipei Hsien, Taiwan. He has made significant contributions to the field of electronics, particularly in the design and layout of motherboard structures. With a total of 11 patents to his name, his work has had a considerable impact on the technology industry.

Latest Patents

One of his latest patents is a layout structure for providing a stable power source to a main bridge chip substrate and a motherboard. This invention focuses on ensuring a reliable power supply for a four-layer motherboard and a main bridge chip substrate. The design incorporates decoupling capacitors connected between ground bonding pads and power bonding pads, enhancing the stability of the power supply for the main bridge chip's operation.

Another notable patent is a layout structure and method for supporting two different package techniques of a central processing unit (CPU). This layout structure allows for flexibility in design, accommodating different package techniques for Pentium IV CPUs on a four-layer motherboard. The innovative approach enables signals from the CPU to be effectively coupled to the control chip, optimizing performance.

Career Highlights

Shu-Hui Chen has worked with notable companies such as Via Technologies, Inc. and Via Technologies, Inc. His experience in these organizations has contributed to his expertise in electronic design and innovation.

Collaborations

Throughout his career, Shu-Hui Chen has collaborated with talented individuals, including Nai-Shung Chang and Tsai-Sheng Chen. These collaborations have fostered a creative environment that has led to groundbreaking advancements in technology.

Conclusion

Shu-Hui Chen's contributions to the field of electronics through his innovative patents and collaborations highlight his role as a key figure in technological advancements. His work continues to influence the design and functionality of modern electronic devices.

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