The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2005
Filed:
Jun. 14, 2002
Layout structure for providing stable power source to a main bridge chip substrate and a motherboard
Nai-shung Chang, Taipei Hsien, TW;
Shu-hui Chen, Taipei Hsien, TW;
Tsai-sheng Chen, Taipei Hsien, TW;
Chia-hsing Yu, Taipei Hsien, TW;
Nai-Shung Chang, Taipei Hsien, TW;
Shu-Hui Chen, Taipei Hsien, TW;
Tsai-Sheng Chen, Taipei Hsien, TW;
Chia-Hsing Yu, Taipei Hsien, TW;
VIA Technologies, Inc., Taipei Hsien, TW;
Abstract
This invention relates to a layout structure for providing stable power supply to a four-layer motherboard and a main bridge chip substrate. In the invention, on the top signal layer and power path of the bottom solder layer for layout of the main bridge chip and on the power ring, the decoupling capacitors are connected in between the ground bonding pads/solder balls and the power bonding pads/solder balls of the power paths and power rings, so as to provide a stable power supply for the operation of the main bridge chip. In this invention, the ground bonding pad/solder ball connected with each power bonding pad/solder ball can be the closest ground bonding pad/solder ball to the power bonding pad/solder ball. In addition, in the embodiment of the main bridge chip substrate, decoupling capacitors can be disposed at four corners of the power ring or underneath the bonding wires, or can be packaged inside the molding compound.