Shu-Ching Ho

Title: The Innovations of Shu-Ching Ho

Introduction

Shu-Ching Ho is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology. His work has led to the development of innovative solutions that enhance the efficiency and functionality of semiconductor packages.

Latest Patents

Shu-Ching Ho holds a patent for a semiconductor package structure and method for manufacturing the same. This patent describes a semiconductor package structure that includes a substrate unit and a first chip stack structure. The substrate unit features a circuit structure with test pads, while the first chip stack structure consists of chips, each equipped with multiple through silicon plugs. These plugs connect adjacent chips electrically and link to the substrate unit's test pads for electrical testing. Additionally, another semiconductor package structure outlined in his patent includes a first and a second semiconductor chip, both having test pads and through silicon plugs for electrical testing. The second chip is mounted on the first, allowing for electrical connections between the two.

Career Highlights

Shu-Ching Ho is associated with Chipmos Technologies Inc., where he continues to innovate in semiconductor packaging. His expertise in this area has positioned him as a key figure in advancing semiconductor technology.

Collaborations

Some of his notable coworkers include David Wei Wang and An-Hong Liu, who have collaborated with him on various projects within the semiconductor field.

Conclusion

Shu-Ching Ho's contributions to semiconductor technology through his innovative patents and collaborations highlight his importance in the industry. His work continues to influence advancements in semiconductor packaging, showcasing the impact of his inventions.