This inventor holds 1 USPTO granted patent. Top assignee: Freescale Semiconductor,inc.. Active years: 2015.
Company Filing History:
Years Active: 2015
Title: The Innovative Mind of Shu An Yao
Introduction
Shu An Yao is a prominent inventor based in Tianjin, China. He has made significant contributions to the field of semiconductor technology. His innovative ideas have led to the development of advanced packaging solutions for integrated circuits.
Latest Patents
One of Shu An Yao's notable patents is for a "Multiple helix substrate and three-dimensional package with same." This invention features a three-dimensional package that includes a substrate with a columnar part and stairs arranged along the sidewall in the form of multiple helixes. The design allows for semiconductor integrated circuits (IC dies) to be attached on one or both supporting surfaces of the stairs. The entire assembly can be encapsulated with a mold compound, enhancing the durability and functionality of the package.
Career Highlights
Shu An Yao is currently employed at Freescale Semiconductor, Inc., where he continues to push the boundaries of semiconductor technology. His work has been instrumental in developing innovative solutions that meet the demands of modern electronics.
Collaborations
Throughout his career, Shu An Yao has collaborated with talented individuals such as Huan Wang and Aipeng Shu. These partnerships have fostered a creative environment that encourages the exchange of ideas and technological advancements.
Conclusion
Shu An Yao's contributions to the field of semiconductor technology exemplify the spirit of innovation. His patent for a multiple helix substrate showcases his ability to think outside the box and develop solutions that address industry challenges. His work continues to inspire future advancements in the field.