The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2015
Filed:
Feb. 11, 2014
Applicants:
Huan Wang, Tianjin, CH;
Aipeng Shu, Tianjin, CH;
Shu an Yao, Tianjin, CH;
Inventors:
Assignee:
Freescale Semiconductor. Inc, Austin, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/04 (2006.01); H01L 23/34 (2006.01); H01L 23/48 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0652 (2013.01); H01L 24/80 (2013.01); H05K 1/141 (2013.01); H05K 1/144 (2013.01); H05K 1/181 (2013.01); H05K 3/284 (2013.01); H05K 2201/041 (2013.01); H05K 2201/09027 (2013.01);
Abstract
A three dimensional package includes a substrate having a columnar part including a sidewall, and stairs or steps arranged along the sidewall of the columnar part in the form of multiple helixes twisted around the columnar part. Semiconductor integrated circuits (IC dies) are attached on one or both of the supporting surfaces of the stairs. The columnar part, the stairs and the IC dies can be encapsulated with a mold compound.