Shriya Seshadri

Title: Shriya Seshadri: Innovator in Semiconductor Packaging

Introduction

Shriya Seshadri is an accomplished inventor based in Chandler, AZ (US). She has made significant contributions to the field of semiconductor packaging. Her innovative approaches focus on enhancing the efficiency and functionality of electronic devices.

Latest Patent Applications

Shriya Seshadri has filed several notable patent applications, including:

1. **METHODS AND APPARATUS FOR EMBEDDING INTERCONNECT BRIDGES HAVING THROUGH SILICON VIAS IN SUBSTRATES** - This application discloses methods and apparatus for embedding interconnect bridges with through silicon vias in substrates. An example semiconductor package includes a bridge die disposed in a recess of an underlying substrate. The bridge die features a via that electrically couples a first contact on one side and a second contact on the opposite side. The recess extends to the first surface of the underlying substrate, with a bond material that electrically and mechanically couples the first contact to an interconnect of the underlying substrate. Additionally, a fill material is positioned between the first side of the bridge die and the first surface of the underlying substrate.

2. **DEEP CAVITY METALLIZATION AND FIDUCIAL ARRANGEMENTS FOR EMBEDDED DIE AND ASSEMBLY THEREOF ON INTEGRATED CIRCUIT PACKAGING** - This application describes an electronic package comprising a substrate core and one or more dielectric material layers. It includes a lower dielectric material layer and multiple metallization layers, with an integrated circuit (IC) die embedded within the dielectric material. The design features at least one conductive feature below and coupled to the IC die, ensuring efficient electrical connections.

Conclusion

Shriya Seshadri is a pioneering inventor whose work in semiconductor packaging is shaping the future of electronic devices. Her latest patent applications reflect her commitment to innovation and excellence in the field.