Milpitas, CA, United States of America

Shri Singhvi


Average Co-Inventor Count = 4.4

ph-index = 4

Forward Citations = 73(Granted Patents)


Company Filing History:


Years Active: 2001-2003

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4 patents (USPTO):

Of course! Here is the article about inventor Shri Singhvi:

Title: Innovator Spotlight: Shri Singhvi - Revolutionizing Semiconductor Metallization in Milpitas, CA.

Introduction:

Shri Singhvi is a visionary inventor based in Milpitas, CA, who has made significant contributions to the field of semiconductor metallization. With an impressive portfolio of 4 patents under his belt, Singhvi's innovative processes have paved the way for advancements in via fill technology and barrier applications in semiconductor manufacturing.

Latest Patents:

1. Staged aluminum deposition process for filling vias: Singhvi's groundbreaking semiconductor metallization process ensures complete via fill on a substrate, void-free, and a planar metal surface without grooves. By depositing a refractory layer followed by a conformal PVD metal layer, such as Al or Cu, at low pressures, the vias and contacts are effectively filled with metal, leading to enhanced performance and reliability.

2. Barrier applications for aluminum planarization: Singhvi's invention provides an effective barrier layer for improved via fill in high aspect ratio sub-micron apertures at low temperatures. By utilizing materials such as Ta, TaN, W, or WN for the barrier layer, coupled with a CVD conformal metal layer and a PVD metal layer deposition process, superior wetting and flow into the vias are achieved, ensuring optimal performance.

Career Highlights:

Throughout his illustrious career, Shri Singhvi has demonstrated a keen focus on innovation and problem-solving in the semiconductor industry. His expertise in metallization processes has not only resulted in the development of cutting-edge technologies but has also earned him recognition as a thought leader in the field.

Collaborations:

Singhvi's collaborative efforts with esteemed coworkers such as Suraj Rengarajan and Peijun Ding have further propelled his innovative endeavors. Together, they have worked tirelessly to push the boundaries of semiconductor metallization and bring novel solutions to the forefront of the industry.

Conclusion:

In conclusion, Shri Singhvi's dedication to innovation and his pioneering work in semiconductor metallization have undoubtedly left a lasting impact on the field. His latest patents stand as a testament to his ingenuity and relentless pursuit of excellence, solidifying his position as a trailblazer in the world of semiconductor technology.

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