This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Shin-Etsu Chemical Co., Ltd.. Active years: 2025.
Company Filing History:
Years Active: 2025
Title: Shree Deshpande: Innovator in Semiconductor Adhesives
Introduction
Shree Deshpande is a notable inventor based in Pittsburgh, PA (US). She has made significant contributions to the field of semiconductor technology, particularly through her innovative patent related to dry adhesives.
Latest Patents
Shree Deshpande holds a patent for a dry adhesive designed for the temporary bonding of semiconductor devices. This invention features a microfiber array comprising a plurality of fibers with enlarged tips. The dry adhesive is capable of adhering to the surface of a silicon wafer and/or carrier. Notably, it can be debonded without the use of chemicals or heat, leaving no residue on the wafer's surface. Additionally, a liquid can be introduced to the interface between the dry adhesive and the semiconductor device to adjust the force of adhesion.
Career Highlights
Shree Deshpande is currently employed at Shin-Etsu Chemical Co., Ltd., where she continues to advance her research and development in adhesive technologies. Her work has garnered attention for its potential applications in the semiconductor industry.
Collaborations
Some of her coworkers include Paul Samuel Glass and Justin Bohn, who contribute to the innovative environment at Shin-Etsu Chemical Co., Ltd.
Conclusion
Shree Deshpande's contributions to the field of semiconductor adhesives highlight her role as an influential inventor. Her innovative solutions are paving the way for advancements in technology.