The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2025
Filed:
Jul. 08, 2021
Applicant:
Shin-etsu Chemical Co., Ltd., Chiyoda-ku, JP;
Inventors:
Paul Samuel Glass, Pittsburgh, PA (US);
Shree Deshpande, Pittsburgh, PA (US);
Justin Bohn, Pittsburgh, PA (US);
Elliot Geikowsky, Pittsburgh, PA (US);
Assignee:
Shin-Etsu Chemical Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 41/00 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01);
Abstract
A dry adhesive microfiber array comprising a plurality of fibers with enlarged tips, where the dry adhesive is capable of adhering to a surface of a silicon wafer and/or carrier. The dry adhesive can be debonded without the use of chemicals or heat and does not leave a residue on the surface of the wafer. In addition, a liquid can be introduced to the interface between the dry adhesive and semiconductor device to adjust the force of adhesion.