Shiun Jaw Hsien

Title: Shiun Jaw Hsien: Innovator in Semiconductor Packaging

Introduction

Shiun Jaw Hsien is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly with his innovative designs that enhance electrical performance.

Latest Patents

Shiun Jaw Hsien holds a patent for a Ball Grid Array (BGA) semiconductor package and substrate. This invention features a chip mounted on the central region of the upper surface of the substrate. The substrate includes an upper surface, a lower surface, a ground plate disposed under the upper surface, and at least one power plate located between the ground plate and the lower surface. A ground ring surrounds the chip and possesses a first set of serrated portions extending toward the outer edge of the substrate. Additionally, a first power ring surrounds the ground ring and has a second set of serrated portions that interlace with the first set. This design optimizes wire bonding distances and enhances the electrical performance of the ground plate.

Career Highlights

Shiun Jaw Hsien is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor packaging.

Collaborations

He has collaborated with notable coworkers, including Yung I Yeh and Shu Jung Ma, contributing to various projects within the company.

Conclusion

Shiun Jaw Hsien's contributions to semiconductor packaging through his innovative patent demonstrate his expertise and commitment to advancing technology in this field. His work continues to influence the industry positively.