Tokyo, Japan

Shinpei Irie


Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: Innovator Spotlight: Shinpei Irie

Introduction: Shinpei Irie is a prominent inventor based in Tokyo, Japan. With a passion for innovative technology, he has made significant contributions to the field, particularly in laminate technology and its applications. His inventive spirit and dedication to research have led him to secure a crucial patent that enhances the manufacturing process of flexible devices.

Latest Patents: Shinpei Irie holds a patent for a "Laminate, method of peeling laminate, and method of manufacturing flexible device." The patent outlines a method that involves forming a first adhesive layer on a substrate, attaching a second substrate, and successfully peeling off the first substrate without damaging the second. This innovation aims to streamline the manufacturing process of flexible devices, showcasing Irie's commitment to improving technical methods in this domain.

Career Highlights: Throughout his career, Shinpei has developed expertise in materials science and engineering. His work at Joled Inc., a leader in advanced technology, has allowed him to explore and implement breakthrough innovations. His unique approach to problem-solving and design has made him a valuable asset to his team and the wider industry.

Collaborations: At Joled Inc., Shinpei collaborates with esteemed colleagues such as Kenichi Izumi and Keisuke Shimokawa. Together, they push the boundaries of technology, working on various projects that aim to revolutionize flexible devices and their applications in everyday life.

Conclusion: Shinpei Irie's contributions to laminate technology demonstrate the importance of innovation in transforming manufacturing processes. With a strong patent portfolio and collaborative spirit, he continues to inspire future generations of inventors and researchers in the tech industry. His work not only adds value to his company but also significantly impacts the broader landscape of flexible device manufacturing.

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