The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2018
Filed:
Sep. 22, 2016
Applicant:
Joled Inc., Chiyoda-ku, JP;
Inventors:
Kenichi Izumi, Tokyo, JP;
Keisuke Shimokawa, Tokyo, JP;
Shin Akasaka, Tokyo, JP;
Hiroyuki Abe, Tokyo, JP;
Shinpei Irie, Tokyo, JP;
Takatoshi Saito, Tokyo, JP;
Assignee:
JOLED, Inc., Chiyoda-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 27/12 (2006.01); H01L 51/00 (2006.01); H01L 51/56 (2006.01); B32B 7/06 (2006.01); B32B 7/12 (2006.01); B32B 43/00 (2006.01);
U.S. Cl.
CPC ...
H01L 51/003 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 43/006 (2013.01); H01L 21/6835 (2013.01); H01L 27/12 (2013.01); H01L 51/0024 (2013.01); H01L 51/0097 (2013.01); H01L 51/56 (2013.01); B32B 2457/20 (2013.01); H01L 2221/6835 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68386 (2013.01); H01L 2227/323 (2013.01); H01L 2227/326 (2013.01); H01L 2251/5338 (2013.01);
Abstract
A method of peeling a laminate according to the disclosure includes: forming a first adhesive layer on a first substrate, the first adhesive layer having adhesive force that satisfies the following Expression (1) and one or both of the following Expressions (2) and (3); firmly attaching a second substrate onto the first adhesive layer; forming a first functional layer on the second substrate; and peeling off the first substrate from the second substrate.