This inventor holds 3 USPTO granted patents. Top assignee: Kaijo Corporation. Active years: 2004-2011.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Hamura, JP (2004)
- Tokyo, JP (2010 - 2011)
Company Filing History:
Years Active: 2004-2011
Title: Shinobu Ishii: Innovator in Wire Bonding Technology
Introduction
Shinobu Ishii is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of wire bonding technology, holding a total of 3 patents. His innovative methods have advanced the efficiency and effectiveness of wire bonding processes in various applications.
Latest Patents
Ishii's latest patents include a wire bonding method, a wire bonding apparatus, and a wire bonding control program. These inventions provide a wire bonding method that enables the formation of a low loop with a height not exceeding two times the wire diameter. This method secures sufficient pull strength of the wire even with the low loop shape. After forming a contact-bonded ball at a first bonding point, a capillary moves upward and then toward a second bonding point to press a side surface of the upper portion of the contact-bonded ball. This action results in the formation of a protruded portion on the top of the contact-bonded ball on the side of the second bonding point. Following this, the capillary moves upward and then downward while moving toward the second bonding point to press the protruded portion, creating a wire drawing portion for drawing the wire horizontally from the top of the contact-bonded ball.
Career Highlights
Shinobu Ishii is currently associated with Kaijo Corporation, where he continues to develop and refine his innovative wire bonding techniques. His work has been instrumental in enhancing the reliability and performance of wire bonding in electronic devices.
Collaborations
Ishii collaborates with notable colleagues, including Hiromi Fujisawa and Toru Arahata. Their combined expertise contributes to the advancement of wire bonding technologies and the successful implementation of innovative solutions in the industry.
Conclusion
Shinobu Ishii's contributions to wire bonding technology exemplify the impact of innovation in the field. His patents and ongoing work at Kaijo Corporation continue to shape the future of electronic manufacturing processes.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile