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Shinobu Ishii

USPTO Granted Patents = 3

Average Co-Inventor Count = 3.3

ph-index = 2

Forward Citations = 23(Granted Patents)

Location History:

Hamura, JP (2004)
Tokyo, JP (2010 - 2011)

Company Filing History:

Kaijo Corporation

Years Active: 2004-2011

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3 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8042725 - Wire bonding method, wire bonding apparatus, and wire bonding control program (2011-10-25),

2. 7748599 - Wire bonding method, wire bonding apparatus, and wire bonding control program (2010-07-06),

3. 6715666 - Wire bonding method, method of forming bump and bump (2004-04-06),

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