The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2011
Filed:
Apr. 22, 2010
Toru Arahata, Tokyo, JP;
Shinobu Ishii, Tokyo, JP;
Hiromi Fujisawa, Tokyo, JP;
Kaijo Corporation, Tokyo, JP;
Abstract
The invention provides a wire bonding method which enables formation of a low loop having a height not exceeding two times the wire diameter and secures sufficient pull strength of the wire even with the low loop shape. After having formed a contact-bonded ball at a first bonding point, a capillary moves upward and then toward a second bonding point to press a side surface of an upper portion of the contact-bonded ball, so that a protruded portion is formed on a top portion of the contact-bonded ball on the side of the second bonding point. After having formed the protruded portion of the contact-bonded ball, the capillary moves upward, and then downward while moving toward the second bonding point to press the protruded portion, so that a wire drawing portion for drawing the wire from the top portion of the contact-bonded ball horizontally is formed.