Shinji Semba

Title: The Innovations of Shinji Semba

Introduction

Shinji Semba is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of seven patents. His work has been instrumental in advancing the manufacturing processes of semiconductor devices.

Latest Patents

One of Shinji Semba's latest patents is a semiconductor device with terminals and a method of manufacturing the same. This innovation involves mounting a plurality of semiconductor chips on a substrate surface, which are then collectively sealed with resin to form resin-sealed sections. A unique feature of this patent is the formation of solder balls on the back surface of the substrate, where the interval between the solder balls of adjacent semiconductor chips is designed to be 'n' times greater than the interval between the solder balls on the semiconductor chip itself. After conducting electrical tests on the semiconductor chips, the resin-sealed sections and the substrate are sliced, effectively breaking the semiconductor chips into individual pieces.

Career Highlights

Shinji Semba has worked with notable companies in the technology sector, including Renesas Technology Corporation and Mitsubishi Electric Corporation. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking innovations in semiconductor technology.

Collaborations

Throughout his career, Shinji has collaborated with esteemed colleagues such as Kunio Kobayashi and Kazunari Michii. These partnerships have fostered a creative environment that has led to the development of advanced technologies.

Conclusion

Shinji Semba's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the manufacturing processes of semiconductor devices, showcasing the importance of innovation in technology.