Shinji Kumon

Title: The Innovative Contributions of Shinji Kumon

Introduction

Shinji Kumon is a notable inventor based in Shinjuku-ku, Japan. He has made significant contributions to the field of flexible multilayer wiring boards. With a total of 2 patents, his work has advanced the technology used in electronic devices.

Latest Patents

Kumon's latest patents focus on the manufacture method of a flexible multilayer wiring board. The first patent describes a process where a metal foil is laminated via an insulating layer to cover the first layer circuit wiring formed on a conductive substrate. A resist layer is then formed to cover the second layer circuit wiring, which is created by pattern-etching the metal foil. This innovative method utilizes the conductive substrate as a power feeding layer, allowing for electrolytic plating to fill interlayer via holes formed by applying a laser beam to the resist layer. This establishes interlayer connections between the first and second layer circuit wirings. The second patent further elaborates on this process, detailing the removal of the resist layer and the formation of external connection terminals.

Career Highlights

Throughout his career, Shinji Kumon has worked with prominent companies, including Sony Corporation and Dai Nippon Insatsu Kabushiki Kaisha. His experience in these organizations has contributed to his expertise in the field of electronics and wiring technologies.

Collaborations

Kumon has collaborated with various professionals in his field, including his coworker Hidetoshi Kusano. Their joint efforts have likely led to advancements in the technologies they have worked on together.

Conclusion

Shinji Kumon's innovative work in flexible multilayer wiring boards has made a significant impact on the electronics industry. His patents reflect a deep understanding of the complexities involved in modern wiring technologies.