Hyogo, Japan

Shinji Hanatani

This inventor holds 1 USPTO granted patent. Top assignee: Takeda Chemical Industries, Inc.. Active years: 1976.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shinji Hanatani. Retrieved from https://idiyas.com/inventor/shinji-hanatani

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 1976

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Shinji Hanatani

Introduction

Shinji Hanatani is a notable inventor based in Hyogo, Japan. He has made significant contributions to the field of packaging technology. His work focuses on improving the efficiency and effectiveness of packaging processes.

Latest Patents

Hanatani holds a patent for a mold assembly designed for use in packaging machines. This invention, titled "Mold assembly for use in packaging machine," facilitates the creation of blistered packages. The mold assembly consists of a preforming structural body with multiple preforming molds and a finishing structural body that contains corresponding finishing molds. This innovative design allows for a preforming process followed by a final forming process, which helps to prevent excessive reduction of wall thickness in the finished blisters. He has 1 patent to his name.

Career Highlights

Shinji Hanatani is associated with Takeda Chemical Industries, Inc., where he applies his expertise in packaging technology. His work has contributed to advancements in the efficiency of packaging processes, benefiting the industry as a whole.

Collaborations

Hanatani has worked alongside talented colleagues, including Takenori Momiyama and Masakazu Oi. Their collaborative efforts have further enhanced the innovative capabilities within their field.

Conclusion

Shinji Hanatani's contributions to packaging technology exemplify the importance of innovation in improving industrial processes. His patent for a mold assembly showcases his commitment to advancing the field, and his collaborations with colleagues highlight the value of teamwork in achieving significant technological advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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