The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 1976
Filed:
Oct. 11, 1974
Takenori Momiyama, Osaka, JA;
Keiiti Mizutani, Osaka, JA;
Masakazu Oi, Osaka, JA;
Shinji Hanatani, Hyogo, JA;
Takeda Chemical Industries, Ltd., Osaka, JA;
Abstract
A mold assembly for use in a packaging machine for making a blistered package, which forms a plurality of blisters in a web of thermoplastic resin film forming a part of the blistered package. The mold assembly comprises a preforming structural body formed with a plurality of preforming molds and a finishing structural body formed with the corresponding number of finishing molds arranged in the same pattern as the preforming molds. The thermoplastic resin web is first subjected to a preforming process with the preforming structural body and then to a final forming process with the finishing structural body thereby to avoid excessive and quick reduction of the wall thickness which may otherwise be observable in any of the finally formed blisters. A method for this purpose is also disclosed.