Hadano, Japan

Shinji Abe

This inventor holds 1 USPTO granted patent. Top assignee: Hitachi, Ltd.. Active years: 1999.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shinji Abe. Retrieved from https://idiyas.com/inventor/shinji-abe-aoaq6tk8

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 9.0

ph-index = 1

Forward Citations = 24(Granted Patents)


Company Filing History:


Years Active: 1999

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1 patent (USPTO):Explore Patents

Title: Innovations of Shinji Abe in Multilayer Circuit Substrates

Introduction

Shinji Abe is a notable inventor based in Hadano, Japan. He has made significant contributions to the field of electronics, particularly in the development of multilayer circuit substrates. His innovative work has led to the creation of a patent that enhances the functionality and reliability of electronic components.

Latest Patents

Shinji Abe holds a patent for a multilayer circuit substrate with a circuit repairing function. This invention features a circuit substrate that includes a circuit pattern and a repair pattern on the inner layer, separated by an inter-substrate insulation film. The design incorporates circuit repairing areas that allow for cutting and bonding of the circuit, along with a terminal bonding pad for attaching electronic circuit parts. Additionally, it includes a conductive via hole that connects the circuit pattern to the terminal bonding pad. Notably, the circuit repairing areas of both the repair pattern and the circuit pattern are positioned close to each other on the same plane, enhancing the substrate's functionality.

Career Highlights

Shinji Abe is associated with Hitachi, Ltd., a leading company in the technology sector. His work at Hitachi has allowed him to focus on innovative solutions that address the challenges faced in electronic circuit design and manufacturing. His contributions have been instrumental in advancing the capabilities of multilayer circuit substrates.

Collaborations

Shinji Abe has collaborated with notable colleagues such as Hiroyuki Hidaka and Tsutomu Imai. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Shinji Abe's contributions to the field of multilayer circuit substrates exemplify the importance of innovation in electronics. His patent reflects a significant advancement in circuit design, showcasing his expertise and commitment to enhancing electronic components.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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