The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 1999
Filed:
Oct. 25, 1995
Kiyoshi Matsui, Yokohama, JP;
Ryohei Satoh, Yokohama, JP;
Michifumi Kawai, Tokyo, JP;
Masashi Ohkubo, Yokohama, JP;
Yutaka Watanabe, Hadano, JP;
Masakazu Yamamoto, Hadano, JP;
Tsutomu Imai, Hadano, JP;
Shinji Abe, Hadano, JP;
Hiroyuki Hidaka, Hadano, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A multilayer circuit substrate with a circuit repairing function which has a circuit substrate having a circuit pattern and repair pattern on the inner layer via an inter-substrate insulation film and having circuit repairing areas for cutting and bonding the circuit on these patterns, a terminal bonding pad for bonding electronic circuit parts mounted on this substrate, and a conductive via hole for bonding said circuit pattern to the terminal bonding pad, wherein at least the circuit repairing area of the repair pattern and at least the circuit repairing area of said circuit pattern which are set on said inner layer are brought close to each other and positioned on the same plane.