Hadano, Japan

Hiroyuki Hidaka


Average Co-Inventor Count = 5.7

ph-index = 3

Forward Citations = 34(Granted Patents)


Company Filing History:


Years Active: 1992-1999

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3 patents (USPTO):Explore Patents

Title: The Innovator Hiroyuki Hidaka: Pioneering Multilayer Circuit Substrates

Introduction: Hiroyuki Hidaka, an accomplished inventor based in Hadano, Japan, has made significant strides in the field of engineering, particularly in the realm of multilayer circuit substrates. With three patents to his name, his work showcases a blend of innovation and practicality that has advanced electronic circuit designs.

Latest Patents: Hidaka's latest inventions include a multilayer circuit substrate featuring a circuit repairing function. This sophisticated design incorporates a circuit substrate with both a circuit pattern and a repair pattern located on an inner layer. It facilitates the bonding of electronic circuit components through a terminal bonding pad and ensures reliable connectivity with conductive via holes. Notably, the circuit repairing areas are strategically positioned to enhance efficiency in repair and maintenance.

He also developed a multichip module equipped with a heat sink and attachment means, designed to maximize packaging density while ensuring high sealing-connection reliability and low manufacturing costs. A notable feature of this design is its sealing-cooling structure, which significantly improves the cooling capabilities of semiconductor devices mounted on the substrate.

Career Highlights: Throughout his career, Hiroyuki Hidaka has contributed his expertise to notable companies including Hitachi, Ltd. and Hitachi Computer Engineering Co., Ltd. His experiences at these leading firms have undoubtedly shaped his innovative approach, allowing him to tackle complex challenges in electronics.

Collaborations: While working on his patents, Hidaka has collaborated with esteemed colleagues such as Kiyoshi Matsui and Ryohei Satoh. These partnerships reflect the collaborative spirit often found in successful technological advancements, underscoring the importance of teamwork in the development of innovative solutions.

Conclusion: Hiroyuki Hidaka stands out as a visionary inventor whose contributions to multilayer circuit substrates have significantly impacted the field of electronics. With his latest patents showcasing cutting-edge designs, he continues to inspire future innovations and pave the way for advancements in technological connectivity.

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