IDiyas

For the Inventor, By the Inventor

Tokyo, Japan

Shingo Sudo

USPTO Granted Patents = 5

 

Average Co-Inventor Count = 3.7

ph-index = 4

Forward Citations = 40(Granted Patents)


Location History:

  • Chiyoda-ku, JP (2010)
  • Tokyo, JP (2009 - 2023)

Company Filing History:

goldMedal5 out of 15,844 
 
Mitsubishi Electric Corporation
 patents

Years Active: 2009-2023

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5 patents (USPTO):Explore Patents
1. 11631653 - Ultrasonic bonding apparatus, ultrasonic bonding inspection method and ultrasonically-bonded portion fabrication method (2023-04-18),
2. 11217514 - Power semiconductor device, method for manufacturing power semiconductor device, and power conversion device (2022-01-04),
3. 7768118 - Semiconductor device (2010-08-03),
4. 7671382 - Semiconductor device with thermoplastic resin to reduce warpage (2010-03-02),
5. 7589412 - Semiconductor device (2009-09-15),
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