Location History:
- Chiyoda-ku, JP (2010)
- Tokyo, JP (2009 - 2023)
Company Filing History:
Years Active: 2009-2023
Title: Shingo Sudo: Innovator in Ultrasonic Bonding and Power Semiconductor Technology
Introduction
Shingo Sudo is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the fields of ultrasonic bonding and power semiconductor devices. With a total of 5 patents to his name, Sudo's work has advanced the technology used in various industrial applications.
Latest Patents
Sudo's latest patents include an ultrasonic bonding apparatus, an ultrasonic bonding inspection method, and a method for fabricating ultrasonically-bonded portions. The ultrasonic bonding apparatus features an ultrasonic bonding machine equipped with an ultrasonic tool that applies ultrasonic waves to a bonding target member. This member is mounted on a fixed object, while a bonding member is pressed against it. Additionally, the bonding inspection apparatus inspects the bonding quality of both the bonding target member and the bonding member. It includes a bonded-state measuring device that detects vibrations in the jig or housing of the ultrasonic bonding machine, outputting a detection signal for analysis.
Another notable patent is related to a power semiconductor device, which involves a method for manufacturing such devices and a power conversion device. In this design, power semiconductor elements are mounted on a large die pad, which is joined to a power lead via a lead stepped portion. The configuration of the large die pad is optimized for performance, ensuring effective power management.
Career Highlights
Shingo Sudo is currently employed at Mitsubishi Electric Corporation, where he continues to innovate and develop new technologies. His work has been instrumental in enhancing the efficiency and reliability of semiconductor devices and bonding techniques.
Collaborations
Sudo has collaborated with notable colleagues, including Tatsuo Ota and Hironori Kashimoto. Their combined expertise has contributed to the successful development of advanced technologies in their respective fields.
Conclusion
Shingo Sudo's contributions to ultrasonic bonding and power semiconductor technology highlight his role as a leading inventor in Japan. His innovative patents and collaborations continue to shape the future of these industries.