This inventor holds 1 USPTO granted patent. Top assignee: Infineon Technologies Ag. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Shin Tieng Liew: Inventor of a Low-Warpage Electronic Package
Introduction
Shin Tieng Liew is an inventor associated with Ipoh, Malaysia, and Infineon Technologies AG. His patent work includes a method designed to reduce warpage in electronic packages during component mounting.
Latest Patents
Liew is named on 1 patent: “Package with Low-Warpage Carrier.” The patent describes a method for manufacturing a package using a carrier with one or more component-mounting regions. The carrier is pre-warped in a selected curvature direction, and an electronic component is mounted to it with a solder structure. During mounting, ambient conditions are applied to the carrier and component, causing the carrier to re-warp and thereby at least partially reduce warpage in the mounting plane.
Career Highlights
Liew’s listed patent reflects work on electronic packaging and manufacturing processes. The disclosed approach addresses carrier warpage during component mounting, a consideration in producing reliable electronic packages.
Collaborations
Liew’s listed coworker is Chiong Yong Tay. The patent information also associates Liew with Infineon Technologies AG.
Conclusion
Shin Tieng Liew’s patent contribution focuses on controlling carrier warpage during electronic component mounting, supporting the development of more stable package-manufacturing processes.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile