The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
Dec. 20, 2023
Infineon Technologies Ag, Neubiberg, DE;
Abdul Rahman Mohamed, Muar, MY;
Shin Tieng Liew, Ipoh, MY;
Chiong Yong Tay, Tangkak, MY;
Lee Shuang Wang, Melaka, MY;
Edmund Jr. Banogon Selorio, Melaka, MY;
Ingrid Maus, Regensburg, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A method of manufacturing a package is disclosed. In one example, the method comprises providing a carrier with at least one component mounting region for mounting at least one electronic component. The carrier is pre-warped in accordance with an initial curvature direction. At least one electronic component is provided, the at least one electronic component comprises at least one first electrode on a first surface and at least one second electrode on a second surface, wherein the second surface is opposite to the first surface. The at least one electronic component is mounted with the second surface on the at least one component mounting region by a solder structure. Ambient conditions are applied to the carrier and to the at least one electronic component during mounting so that the carrier is re-warped to thereby at least partially reduce warpage of the carrier in a mounting plane.