Shin Takanezawa

Title: Innovations by Shin Takanezawa

Introduction

Shin Takanezawa is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of materials science, particularly in the development of advanced prepreg materials. His work focuses on enhancing the properties of materials used in electronic applications.

Latest Patents

Shin Takanezawa holds a patent for a prepreg, laminate, and production methods therefor, as well as a printed circuit board and semiconductor package. This innovative prepreg is designed to achieve a reduction in thermal expansion coefficient and an increase in elastic modulus without the need for a higher filling ratio of inorganic fillers or the use of resins with low thermal expansion coefficients. The prepreg contains glass fibers and a thermosetting resin composition, featuring a layer of aligned glass fiber filaments running nearly parallel to each other. This design effectively reduces warpage, making it suitable for various electronic applications.

Career Highlights

Shin Takanezawa is currently employed at Resonac Corporation, where he continues to push the boundaries of material innovation. His work has been instrumental in developing products that meet the demanding requirements of modern electronics.

Collaborations

Shin collaborates with talented colleagues, including Mari Shimizu and Daisuke Fujimoto. Together, they contribute to the advancement of technology in their respective fields.

Conclusion

Shin Takanezawa's innovative work in the development of advanced prepreg materials showcases his commitment to enhancing electronic applications. His contributions are vital to the ongoing evolution of materials science.