The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2025
Filed:
Dec. 10, 2018
Hitachi Chemical Company, Ltd., Tokyo, JP;
Mari Shimizu, Tokyo, JP;
Daisuke Fujimoto, Tokyo, JP;
Yasuo Kamigata, Tokyo, JP;
Tomohiko Kotake, Tokyo, JP;
Shin Takanezawa, Tokyo, JP;
Akira Shimizu, Tokyo, JP;
Harumi Negishi, Tokyo, JP;
Kouichi Aoyagi, Tokyo, JP;
Sayaka Kikuchi, Tokyo, JP;
RESONAC CORPORATION, Tokyo, JP;
Abstract
Provided is a prepreg capable of attaining thermal expansion coefficient reduction and elastic modulus increase without increasing the filling ratio of an inorganic filler therein and/or without using a resin having a low thermal expansion coefficient, and thereby capable of reducing warpage thereof. Specifically, provided is a prepreg containing glass fibers and a thermosetting resin composition, and containing a layer of plural glass fiber filaments aligned to run nearly parallel to each other in one direction. Also provided are a production method for the prepreg, a laminate containing the prepreg and its production method, a printed circuit board containing the laminate, and a semiconductor package having a semiconductor device mounted on the printed circuit board.