Harumi Negishi

Title: Harumi Negishi: Innovator in Prepreg Technology

Introduction

Harumi Negishi is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of materials science, particularly in the development of prepreg technology. His innovative work has led to advancements that enhance the performance of electronic components.

Latest Patents

Negishi holds a patent for a prepreg, laminate, and production methods therefor, as well as a printed circuit board and semiconductor package. This patent addresses the need for a prepreg that can achieve a reduction in thermal expansion coefficient and an increase in elastic modulus without raising the filling ratio of inorganic fillers or utilizing resins with low thermal expansion coefficients. The prepreg consists of glass fibers and a thermosetting resin composition, featuring a layer of multiple glass fiber filaments aligned in a nearly parallel direction. This innovation is crucial for reducing warpage in electronic applications.

Career Highlights

Negishi is currently employed at Resonac Corporation, where he continues to push the boundaries of material technology. His work has been instrumental in developing solutions that meet the demands of modern electronics, particularly in the areas of printed circuit boards and semiconductor packaging.

Collaborations

Negishi collaborates with talented colleagues, including Mari Shimizu and Daisuke Fujimoto. Their combined expertise fosters a creative environment that drives innovation within the company.

Conclusion

Harumi Negishi's contributions to prepreg technology exemplify the impact of innovative thinking in the field of materials science. His patent reflects a commitment to enhancing electronic component performance, showcasing the importance of research and development in advancing technology.