Tainan, Taiwan

Shin-Sheng Huang

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shin-Sheng Huang. Retrieved from https://idiyas.com/inventor/shin-sheng-huang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Innovations by Shin-Sheng Huang

Introduction

Shin-Sheng Huang is an inventor based in Tainan City, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the development of trench isolation structures. Although he currently holds no granted patents, his innovative ideas are reflected in his patent applications.

Latest Patent Applications

One of his notable patent applications is for a "STEPPED BACK SIDE DEEP TRENCH ISOLATION STRUCTURE." This application describes a method for forming trenches using two etches: a high-aspect ratio etch and a mouth etch. The design features an upper part that is wider and a lower part that is narrower, exhibiting a step change in width. The depth of the lower part is fixed to maintain a high aspect ratio while ensuring consistent filling without voids. This innovative structure aims to enhance the optical performance characteristics of image sensors compared to traditional single trench etches.

Conclusion

Shin-Sheng Huang's work in trench isolation structures showcases his commitment to advancing semiconductor technology. His innovative approaches have the potential to significantly improve optical performance in image sensors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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