Shin Nakao

Title: The Innovations of Shin Nakao

Introduction

Shin Nakao is a prominent inventor based in Hyogo, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 8 patents. His work focuses on improving the efficiency and reliability of semiconductor packages.

Latest Patents

One of Nakao's latest patents is for a resin seal semiconductor package and its manufacturing method. This innovative design involves forming bonding pads on the main surface of a semiconductor chip. An insulating layer with openings located on the bonding pads is created, followed by the formation of base metal layers on these pads. A buffer coat film is then applied, which has a portion laid on the periphery of the base metal layer. Connection layers are formed on the base metal layers, and first conductors are established on these connection layers. A seal resin that exposes only the top surfaces of the first conductors is formed, and lumpish second conductors are placed on these surfaces. This process results in a compact resin seal semiconductor package that boasts improved electrical characteristics and high reliability.

Career Highlights

Shin Nakao is currently employed at Mitsubishi Electric Corporation, where he continues to innovate in the semiconductor field. His work has been instrumental in advancing the technology used in various electronic devices.

Collaborations

Nakao has collaborated with notable coworkers such as Masatoshi Yasunaga and Shinji Baba. Their combined expertise has contributed to the successful development of several patents and innovations in semiconductor technology.

Conclusion

Shin Nakao's contributions to the semiconductor industry are noteworthy, particularly through his innovative patents that enhance the performance and reliability of semiconductor packages. His work at Mitsubishi Electric Corporation and collaborations with esteemed colleagues further solidify his impact in the field.