The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 1991
Filed:
Apr. 02, 1990
Applicant:
Inventor:
Shin Nakao, Itami, JP;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ; H01L / ;
U.S. Cl.
CPC ...
357 72 ; 357 81 ; 437211 ; 437224 ;
Abstract
A semiconductor device is provided with an electrically conductive cap having a sufficiently thick edge portion for preventing warpage due to the hardening of an encapsulating resin. Since the edge portion of the conductive cap is formed into the shape of a frame, and its thickness is made large, the mechanical strength of the conductive cap is improved, so that even when stress is applied to the conductive cap owing to the hardening of the encapsulating resin, the conductive cap is unlikely to undergo deformation, thereby preventing the warping of the semiconductor device.
Nakao, Shin. (1991). Semiconductor device (U.S. Patent No. 5016084). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5016084
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile