This inventor holds 1 USPTO granted patent. Top assignees: Samsung Electro-Mechanics Co., Ltd., Snu Rdb Foundation. Active years: 2013.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
1 out of 7,950 
1 out of 549 
Years Active: 2013
Title: The Innovations of Shin Bok Lee
Introduction
Shin Bok Lee is a notable inventor based in Paju-si, South Korea. He has made significant contributions to the field of printed circuit substrates, showcasing his expertise through his innovative patent.
Latest Patents
Shin Bok Lee holds a patent for a printed circuit substrate and the method of manufacturing the same. This invention includes an insulating layer and a circuit layer that features a circuit pattern on the insulating layer. A barrier layer is also included, which covers at least one surface of the circuit pattern to suppress electrochemical migration. This innovation allows for high-density applications while ensuring reliability.
Career Highlights
Throughout his career, Shin Bok Lee has worked with prominent companies, including Samsung Electro-Mechanics Co., Ltd. and Snur & Db Foundation. His experience in these organizations has contributed to his development as an inventor and has provided him with valuable insights into the industry.
Collaborations
Shin Bok Lee has collaborated with notable colleagues such as Hyung Wook Park and Young Chang Joo. These partnerships have likely enhanced his work and contributed to the success of his inventions.
Conclusion
Shin Bok Lee's contributions to the field of printed circuit substrates demonstrate his innovative spirit and commitment to advancing technology. His patent reflects a significant step forward in ensuring reliability and efficiency in electronic components.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile